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采用微生物技术、表面分析技术以及电化学测量技术,研究了从再生水环境中分离提纯得到的硫酸盐还原菌(SRB)的形态、生长规律,以及SRB对铜合金HSn701-AB在再生水环境中腐蚀的影响.结果表明,在再生水环境中SRB的生长曲线存在2d～3d的停滞期;铜合金HSn701-AB在接种SRB的再生水环境中浸泡3 d时,出现阻挡层扩散阻抗,随着浸泡时间的增长,腐蚀加重,20d时其表面生成致密的SRB生物膜.
The morphology and growth of sulfate-reducing bacteria (SRB) isolated and purified from reclaimed water were studied by using microbial technology, surface analysis and electrochemical measurement techniques. The effects of SRB on the corrosion of copper alloy HSn701-AB in reclaimed water .The results showed that there was a stagnant period of 2d to 3d in the growth curve of SRB in reclaimed water and that of HSn701-AB in the regenerated water environment with SRB immersed for 3 days. With the increase of immersion time , The corrosion is aggravating. On the 20th day, dense SRB biofilm is formed on the surface.