论文部分内容阅读
大功率半导体激光器列阵的光纤耦合模块对光纤焊接的要求很高,在焊接中不希望用有机粘接剂和有助焊剂的金属焊膏,有机物在激光器工作时挥发出有机物质。这些有机物会污染激光器腔面,致使激光器工作时腔面温度很高。附着在腔面的有机物就会碳化,影响激光器的出光,并且还会导致激光器烧毁。提出用电场辅助焊接的方法,使光纤在硅片的V型槽中固定,取得了良好效果,在焊接中不使用助焊剂,不使用有机粘接剂,减少了激光器腔面的污染,从而延长了半导体激光器光纤耦合模块的寿命。测试结果表明,其剪切力最大可达35 MPa。
Fiber-coupled modules for high-power semiconductor laser arrays have high demands on optical fiber soldering. Organic solders and metal solder pastes with fluxes are not desirable for soldering, and organic materials volatilize organic materials during laser operation. These organic compounds contaminate the laser cavity surface, causing the cavity surface temperature to be high when operating the laser. The organic matter attached to the cavity will be carbonized, affecting the light emitted by the laser, and will also cause the laser to burn out. An electric field assisted welding method is proposed to fix the optical fiber in the V-shaped groove of the silicon wafer and obtain a good effect. The flux is not used in the soldering, and no organic adhesive is used to reduce the pollution of the laser cavity surface. Extend the life of the semiconductor laser fiber coupling module. The test results show that the maximum shearing force can reach 35 MPa.