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微水射流导引激光加工是一种热影响区小,具有高加工精度的新型技术。本文基于有限体积法建立了微水射流导引激光束对硅片打孔过程的传热模型,将打孔过程分为三个阶段模拟其间的热量传递、相变过程和相边界的移动;探索了微水射流导引双脉冲激光打孔过程,进行了双脉冲不同延迟时间下的传热过程的数值模拟,得到了最佳延迟时间。结果表明:在初始加热阶段,高温区出现在表面以下区域;微水射流有强冷却作用并明显减小了热影响区;双脉冲激光的应用可以有效提高打孔的效率。
Micro-jet-guided laser processing is a new technology with small heat-affected zone and high processing precision. Based on the finite volume method, the heat transfer model of the micro-water jet guided laser beam to the drilling process of silicon wafer is established. The drilling process is divided into three stages to simulate the heat transfer, phase transition and phase boundary movement. The micro-water jet guided double-pulse laser drilling process was carried out. The numerical simulation of the heat transfer process under different pulse delays was carried out. The optimal delay time was obtained. The results show that in the initial heating stage, the high temperature zone appears in the area below the surface. The micro-water jet has a strong cooling effect and obviously reduces the heat affected zone. The application of double pulsed laser can effectively improve the drilling efficiency.