论文部分内容阅读
硅直接键合工艺(SDB)自1986年Shimbo提出以来,日益受到国内外的重视。SDB与IC工艺兼容且具灵活的优点,为硅传感器提供了一种新的加工手段。对力学量传感器而言,传感原理是通过外加负载在硅中产生应变,而硅直接键合工艺是否引入新的应变,直
Since the introduction of Shimbo in 1986, the direct bonding process (SDB) of silicon has been paid more and more attention both at home and abroad. SDB is compatible with IC technology and flexible, providing a new processing tool for silicon sensors. For mechanical sensors, the sensing principle is to generate strain in the silicon by the applied load, and whether the silicon direct bonding process introduces a new strain or not