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目的评价某芯片封装测试项目职业病危害因素控制效果,为项目竣工验收提供依据。方法依据相关资料,进行现场职业卫生学调查和职业危害因素检测,采用工程分析、定性定量分析等方法进行评价。结果噪声、化学毒物、工频电磁场是芯片封装测试生产的主要职业病危害因素。其中,4个噪声测定点超标,该4点均为巡视人员巡检岗位,其接触噪声8 h等效声级为77.7dB(A);化学毒物、工频电磁场作业点检测结果均符合国家职业卫生标准。结论该项目为职业病危害一般的建设项目,该项目采取了卫生工程防护措施与个人防护措施相结合的方法控制职业有害因素,对接触有毒有害作业人员进行职业健康监护,职业病防护措施效果良好。
Objective To evaluate the control effect of occupational hazards in a chip package test project and provide the basis for the completion acceptance of the project. Methods Based on the relevant data, the on-site occupational hygiene investigation and occupational hazards were tested, and the methods of engineering analysis and qualitative and quantitative analysis were used to evaluate. The results of noise, chemical poisons, power frequency electromagnetic field is the main occupational hazards of chip packaging and testing production. Among them, 4 noise measurement points exceeded the 4 points for the inspection staff inspection positions, the contact noise 8 h equivalent sound level was 77.7dB (A); chemical poisons, power frequency electromagnetic field test results are in line with national occupations health standard. Conclusion This project is a general construction project with occupational hazards. This project adopts a combination of sanitation engineering protection measures and personal protection measures to control occupational hazards, and occupational health monitoring in case of contact with poisonous and harmful workers, and the occupational disease prevention measures are effective.