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本文介绍了微电子制造科学和技术（MMST）规划中所要使用的设备及工艺，这些工艺是在由测试台（AVP，由TI公司，设计和制造的先进真空处理器）和商品化的生产设备组合而成的系统中以单片方式实现的。所有的AVP工艺都是在硅片倒向放置面朝下的结构中完成。所有的工艺设备都与计算机集成制造系统（CIMS）相连。CIM可以采集设计数据而且可以将采自CIM数据库的工艺参数与单个处理单元连接起来。在某些可利用的地方，通过现场探测器来监控工艺参数，探测器的测量值采自硅片中央的一个测量芯片。大多数工艺是由CIM系统中建立在模型基础上的工艺控制算法来控制的。换句话说，是采用标准的统计工艺控制（SPC）方法控制的。本文重点介绍了开发并用于这种CIM环境的工艺方法学。采用这种工艺方法学在不到72小时的时间内完成了一个大约有150道工序的0．35μmCMOS工艺
This article describes the equipment and processes to be used in the Microelectronics Manufacturing Science and Technology (MMST) program, which is performed on a test bench (AVP, an advanced vacuum processor designed and manufactured by TI) and commercial production equipment The combination of the system to achieve monolithic way. All AVP processes are done with the silicon wafer facing downwards. All process equipment is connected to Computer Integrated Manufacturing System (CIMS). CIM can capture design data and can connect process parameters taken from the CIM database to a single processing unit. In some available locations, the process parameters are monitored by a field probe whose measurements are taken from a measurement chip in the center of the wafer. Most processes are controlled by process control algorithms built on the model in the CIM system. In other words, it is controlled using the standard Statistical Process Control (SPC) method. This article highlights the process methodology developed and used in this CIM environment. Using this methodology, a 0.35-μm CMOS process with approximately 150 steps was completed in less than 72 hours