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用弯曲法、划痕法研究了镀后加热温度对Ni-P化学镀层结合力的影响,结果表明:镀后退火温度越高,镀层结合力越好,但温度过高时,镀层硬度将下降。用金相观察及电子探针分析,探讨了镀后退火温度影响结合力的机理。结果指出:退火时将在镀层和基体界面上发生Ni与Fe的互扩散,形成Ni-Fe合金扩散层,从而提高了结合力。为了能在保证镀层硬度的前提下提高结合力,本文提出了二次镀覆的设想,获得较好试验结果。
The influence of heating temperature after plating on the adhesion of Ni-P electroless plating was studied by bending method and scratch test. The results showed that the higher the annealing temperature, the better the cohesion of the coating, but the higher the temperature, the lower the hardness of the coating . Using metallographic observation and electron probe analysis, the mechanism of annealing temperature after plating affecting the bonding force was discussed. The results indicate that the interconducting diffusion of Ni and Fe occurs at the interface between the coating and the substrate during the annealing process to form a Ni-Fe alloy diffusion layer, thereby improving the bonding strength. In order to improve the bonding strength under the premise of ensuring the hardness of the coating, this paper presents the concept of secondary plating, to obtain better test results.