论文部分内容阅读
本文介绍了自动带焊（ＴＡＢ）器件的载带结构及其电参数，构造了集中参数的等效电路．用ＰＳＰＩＣＥ程序对ＴＡＢ器件和引线键合器件的高频特性进行分析和对比后，阐明了ＴＡＢ器件在高频特性方面优于传统封装形式的器件。通过长线模型，模拟了ＴＡＢ器件的延时特性；并分析了ＴＡＢ器件的热特性。
This paper introduces the tape structure and its electrical parameters of automatic band welding (TAB) devices and constructs the equivalent circuit of lumped parameters. After analyzing and comparing the high-frequency characteristics of TAB devices and wire bonding devices with PSPICE program, it is clarified that the TAB devices are superior to the conventional package devices in terms of high-frequency characteristics. Through the long-term model, the delay characteristics of the TAB device are simulated. The thermal characteristics of the TAB device are analyzed.