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研究了快速凝固工艺对Sn-8Zn-3Bi合金显微组织和熔化特性的影响,分析了经150°C高温时效后钎料/铜焊点显微组织演变以评估连接的可靠性。结果表明:经快速凝固后,Sn-8Zn-3Bi合金中的Bi完全固溶于Sn基体并形成枝晶结构;与常规熔铸态合金相比,Bi在Sn基体中的过饱和固溶导致快速凝固态钎料的熔点上升至接近Sn-Zn共晶合金熔点,但同时减小了由于Bi添加对Sn-Zn合金熔化行为产生的不利影响,钎料/铜焊点界面金属间化合物(IMC)层更为致密和均匀;使用快速凝固态钎料能够显著抑制高温时效过程中钎料/铜焊点界面IMC的形成与生长并改善其界面高温稳定性。
The effect of rapid solidification process on the microstructure and melting characteristics of Sn-8Zn-3Bi alloy was investigated. The microstructure evolution of the solder / braze joint after aging at 150 ° C was analyzed to evaluate the reliability of the joint. The results show that after rapid solidification, Bi in the Sn-8Zn-3Bi alloy completely dissolves in the Sn matrix and forms a dendritic structure. The supersaturated solid solution of Bi in the Sn matrix results in rapid solidification State solder increases to near the melting point of the Sn-Zn eutectic alloy, while at the same time reducing the adverse effect of Bi addition on the melting behavior of the Sn-Zn alloy, the solder / copper pad intermetallic compound (IMC) layer More compact and uniform. Using rapid solidified solder can significantly inhibit the formation and growth of IMC at the solder / copper interface and improve the high temperature stability of the interface at high temperature aging.