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采用改性环氧膜塑料,通过专用设备和模具,把带有引线的半导体芯片封装起来的器件,可统称为模塑半导体器件.本文介绍参数为2CZ83的模塑二极管的设计和制造,其产品标准为SJ913-74.笔者在四年前用两年的时间完成了试制,其设备和材料全部基于国内,至今已生产百万支.国外这类器件早已大批生产,具有代表性的是1N4001～7.1.结构产品的结构见图1,这种结构的机械性能和环境性能是令人关注的.
The use of modified epoxy film plastic, through special equipment and mold, the semiconductor chip with leads encapsulated devices, collectively referred to as molded semiconductor devices.This article describes the design and manufacture of molded diode parameters 2CZ83, and its products Standard SJ913-74. The author in four years ago completed the trial in two years time, all of its equipment and materials based on domestic, has produced millions of units abroad. Such devices have long been mass-produced, representative of the 1N4001 ~ 7.1. Structure The structure of the product is shown in Figure 1. The mechanical and environmental properties of this structure are of concern.