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作为IBM 系列中档机的4381处理装置,组装对它的计算机能起着关键作用.因此,这种新型计算机在不需要空调冷却的情况下,提供的性能为它的前身—IBM 4341的3倍.该公司采用空气喷射冷却技术,每瓩每秒执行2百万条指令,为4341机的2倍.因此,元件级的功率密度增加了5倍.高密度组装电路消除了各组装级完整的要求,与4341上山芯片—模块—插件—底板几级齐全的组装不同,4381有一块安装在模块上的芯片,这些模块依次安放在单个底板上,因此,它完全取消了插件.从而使4381每块模块上的电路数相当4341每个插件上的数量的2倍,将200000以上的电路互相连接在22个空气冷却模块上.每个模块由三个主要部件构成:一个冷却部件;一个作为芯片载体的基片及36个包含大约700个电路的芯片.为了冷却电路,一个风机提供空气给强制通风腔,并引导空气同时通过平行排列的喷咀,使插在线路底板上的所有模块得到冷却.空气以10m/s以上的速度垂直喷向安装在底板上的模块,然后以1.5m/s 的低速通过每个散热片底部附近的出口,进入计算机支架周围的通道.IBM 指出,这种并行冷却方式优于串行冷却方式,具有两个主要优点:第一,每个模块接收的都是未经相邻模块加热的新鲜空气;第二,
The 4381 processor, the IBM midrange device, can play a key role in the assembly of its computer, so the new computer offers three times the performance of its predecessor, the IBM 4341, without the need for air conditioning. The company used air-jet cooling technology to perform 2 million instructions per second, twice as many as the 4341, resulting in a fivefold increase in component-level power density. The high-density assembly eliminates complete assembly-level requirements , And the 4341 uphill chip - module - plug-in - a few complete assembly of the backplane is different, the 4381 has a chip mounted on the module, which in turn placed on a single base plate, so it completely cancel the plug. The number of circuits on the module equals twice the number of 4341’s per plug-in, connecting more than 200,000 circuits to each of the 22 air-cooled modules Each module consists of three main components: a cooling unit, And 36 chips containing about 700. To cool the circuit, a fan provides air to the forced air chamber and directs the air through the parallel-arranged nozzles so that the line plugged into the line All modules on the board are cooled.Air air is sprayed perpendicularly at a rate above 10 m / s onto the module mounted on the backplane, and at a low speed of 1.5 m / s through the exit near the bottom of each heat sink, into the passage around the computer support IBM said that this parallel cooling is superior to serial cooling and has two major advantages: first, each module receives fresh air that is not heated by adjacent modules; and second,