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稳定性是衡量化学机械抛光(CMP)中抛光液性能的一个重要指标,低磨料和低p H值是抛光液发展的方向。研究了不同p H值对低磨料碱性铜抛光液稳定性的影响。选取了磨料质量分数为1%的抛光液,加入磷酸调节p H值,得到p H值分别为7.3,8.11,9.21,10.02和11.04抛光液,测量比较了各组抛光液随存放时间的变化其p H值、磨料粒径、Zeta电位和铜去除速率的变化。结果表明,低磨料碱性铜抛光液的p H值随时间的延长而降低,磨料粒径也随存放时间的延长而变大,抛光液的Zeta电位的绝对值随p H值的降低而降低,铜的去除速率随抛光液的存放时间的增加而降低,当p H值为9.21~10.02时,抛光液存放时间超过48 h。
Stability is an important indicator of polishing solution performance in chemical mechanical polishing (CMP). Low abrasive and low p H values are the development direction of polishing solution. The effect of different p H values on the stability of low abrasive alkaline copper polishing solutions was investigated. The polishing solution with abrasive mass fraction of 1% was selected, phosphoric acid was added to adjust the p H value, and the p H values were obtained as 7.3, 8.11, 9.21, 10.02 and 11.04 polishing solution respectively. p H value, grain size, Zeta potential and copper removal rate. The results show that the p H value of low abrasive alkaline copper polishing solution decreases with time and the particle size of abrasive increases with the prolonging of storage time. The absolute value of Zeta potential of polishing solution decreases with the decrease of p H value , The removal rate of copper decreases with the storage time of the polishing solution. When the pH value is 9.21 ~ 10.02, the polishing solution storage time is longer than 48 h.