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介绍了一种用于覆铜板厚度检测的光电式非接触测量装置及其工作原理。每个测量点由上下一对测量探头和一套检测处理电路组成。其中，测量探头由一个半导体激光器作光源，面阵ＣＭＯＳ图像传感器按场进行图像采集，经检测处理电路处理得到物体的位置，再由计算机计算并显示被测物体的厚度。该系统具有测量精度高、体积小、成本低、易扩充测量点等特点
A photoelectric non-contact measuring device for detecting the thickness of CCL and its working principle are introduced. Each measurement point by a pair of upper and lower measurement probe and a detection processing circuit. Among them, the measuring probe consists of a semiconductor laser as the light source, and the area array CMOS image sensor collects the image by the field. The position of the object is processed by the detection and processing circuit, and then the thickness of the measured object is calculated and displayed by the computer. The system has high measurement accuracy, small size, low cost, easy to expand measurement points and so on