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叠层管芯封装的不断发展导致该技术能有效地在同一基底内增大电子器件的功能和容量,作为单个芯片。蜂窝电话及其它消费类产品中叠层芯片封装的应用增长促使能够在给定封装尺寸中封装多层芯片。介绍了叠层芯片封装技术中最主要是满足总封装高度的要求。用于叠层芯片封装的技术实现方法包括基片减薄、薄裸芯片贴装、小形貌引线键合、与无支撑的边缘键合以及小偏倒成形等。集中介绍了叠层管芯互连要求。介绍了倒装芯片应用中的正向球形键合、反向球形键合和焊凸凸焊技术,讨论了优点和不足。说明球形键合机的发展能够满足叠层芯片封装的挑战,即超低环形状、长引线跨距和悬空键合等。
The continuous development of stacked die packages has led to the technology to effectively increase the functionality and capacity of electronic devices within a single substrate as a single chip. The increased use of laminated chip packages in cellular phones and other consumer products has led to the ability to package multi-layer chips in a given package size. This paper introduces the most important requirement of the package chip packaging technology to meet the total package height requirements. Techniques for multilayer chip packaging include substrate thinning, thin bare chip placement, small profile wire bonding, unsupported edge bonding, and small offset forming. Focus on the laminated die interconnect requirements. The introduction of the flip-chip application of the forward ball bonding, reverse ball bonding and solder bump welding technology, discusses the advantages and disadvantages. Description of the development of the ball bonding machine to meet the challenges of laminated chip package, that ultra-low-ring shape, long lead span and dangling bonding.