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本文用差热分析(DTA),X 射线衍射分析,SEM 观察及磨削试验研究了镀 W 金刚石与铜合金结合剂界面成分、结构及结合性能。结果表明:在700～1250℃范围内,镀 W 层与金刚石发生界面反应,在金刚石表面外延生成岛状 WC 和 W_2C 从而实现了金刚石与 W 镀层间的冶金结合,即金刚石表面金属化。镀 W 金刚石与铜合金的粘结强度可达4×10~7Pa。用镀钨金刚石制成的磨块磨削比、出刃高度得到提高,金刚石的脱落率大幅度下降。
In this paper, the interfacial composition, structure and bonding properties of W-coated diamond with copper alloy were studied by differential thermal analysis (DTA), X-ray diffraction analysis, SEM observation and grinding test. The results show that in the temperature range of 700 ~ 1250 ℃, the interfacial reaction between the W layer and the diamond occurs and the islands WC and W_2C are epitaxially formed on the surface of the diamond to achieve the metallurgical bonding between the diamond and the W coating, that is, the surface metallization of the diamond. Coated W diamond and copper alloy strength up to 4 × 10 ~ 7Pa. Abrasive grinding blocks made of tungsten-plated diamond improve the height of the cutting edge and significantly reduce the rate of diamond loss.