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日本一家公司研制成一种适用于包装电子设备和半导体的超薄纯铁箔。它是一种含铁量为９９．９％以上的纯铁薄膜，具有许多优点：一、机械强度高，相当于硬铝箔强度的３倍，软铝箔的６倍；二、具有很高的磁导率、良好的磁吸收能力和电磁波屏蔽能力；三、具有１５００℃的高熔点
A Japanese company has developed a thin, pure iron foil suitable for packaging electronics and semiconductors. It is a pure iron film with an iron content of over 99.9%, which has many advantages: 1. High mechanical strength, equivalent to 3 times the strength of hard aluminum foil and 6 times of soft aluminum foil; 2. High magnetic Conductivity, good magnetic absorption and electromagnetic shielding ability; Third, with a 1500 ℃ high melting point