论文部分内容阅读
以PCB片式电阻器件无铅焊点为研究对象,开展与有铅焊点剪切力-热疲劳状态比较试验研究。采用了伪失效寿命比较方法,获得了有限周期温度冲击下的焊点剪切力试验数据,采用非线性最小二乘法进行剪切力数据的曲线拟合。结果表明,封装尺寸是影响焊点热疲劳性能的重要因素。在1 500个有限周期内,无铅焊点的热疲劳性能优于有铅焊点。
Taking the lead-free solder joint of PCB chip resistor as the research object, a comparative experimental study on the shear stress-thermal fatigue state of lead solder joints was carried out. Pseudo-failure life comparison method was adopted to obtain the experimental data of shear stress under the impact of finite period temperature. The nonlinear least square method was used to curve fit the shear force data. The results show that the package size is an important factor affecting the thermal fatigue properties of solder joints. In a finite period of 1 500, the thermal fatigue properties of lead-free solder joints are superior to lead solder joints.