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采用化学气相沉积技术,用氢气还原氯化铜的方法在氧化铝复相陶瓷表面制备铜涂层,确定适宜工艺参数并研究铜涂层对氧化铝复相陶瓷/铁复合材料界面结合的影响。利用X射线衍射仪、扫描电镜等对样品的显微组织、物相和表面形貌进行分析。研究结果表明:采用化学气相沉积技术在氧化铝复相陶瓷表面制备铜涂层的适宜工艺参数为:沉积温度850℃,保温时间为40 min时,获得的铜涂层均匀致密,且纯度较高。涂层与氧化铝复相陶瓷之间由于热膨胀系数的差异,在界面结合处存在小裂缝。氧化铝复相陶瓷/铁复合材料由于在界面处发生元素的扩散互熔有利于界面的结合。氧化铝复相陶瓷/铁复合材料界面结合良好,无明显的孔洞及裂缝等缺陷。
The chemical vapor deposition technique was used to reduce the copper chloride by hydrogen gas to prepare the copper coating on the surface of the alumina composite ceramic. The suitable process parameters were determined and the influence of the copper coating on the interface bonding of the alumina composite ceramic / iron composite was studied. The microstructure, phase and surface morphology of the samples were analyzed by X-ray diffraction and scanning electron microscopy. The results show that the optimum technological parameters of copper coating prepared by chemical vapor deposition on the surface of alumina composite ceramics are as follows: the deposition temperature is 850 ℃, the holding time is 40 min, the obtained copper coating is uniform and compact with high purity . Due to the difference in thermal expansion coefficient between the coating and the alumina composite ceramic, there are small cracks in the interface junction. Alumina composite ceramic / iron composites due to the diffusion of elements in the interface mutual melting is conducive to the integration of the interface. Alumina composite ceramic / iron composite interface with good bonding, no obvious holes and cracks and other defects.