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本文通过对空芯印制板模块热设计的计算以及与依靠金属板导热模块的散热对比，说明了空芯印制板模块在电子设备中具有较高的散热性能和较强的适应性。
In this paper, the calculation of the thermal design of the air core PCB module and the comparison with the thermal dissipation of the thermal module based on the metal plate demonstrate that the air core PCB module has high heat dissipation performance and strong adaptability in the electronic device.