MEMS' Candidacy of 3D IC Silicon Chip

来源 :2012传感器与MEMS技术产业化国际研讨会 | 被引量 : 0次 | 上传用户:qq2285387
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In the past one year 3DIC has become a hotspot in IC design industry. With this advanced technology, the Chip with Mems will be improve in performance, Power consumption, size.
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