高效晶硅光伏组件低封装损技术研究

来源 :2018 年第十四届中国太阳级硅及光伏发电研讨会 | 被引量 : 0次 | 上传用户:a62058803
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本文阐述了高效晶硅光伏组件低封装损技术,搭配0.27mm焊带+白色EVA+3mm间距组合后组件功率没有单个材料单独使用带来的增益之和高,且单独使用白色EVA比单独使用加0.27mm焊带功率增益要高。搭配0.27mm焊带+0.45mm透明EVA的组件平均功率较0.5mmEVA提升0.4W左右,但碎片及隐裂不良率较高。
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