Thermal Challenges of LED Frontlighting Design

• 作 者: MengHan[1]JosefSchug[2]
• 机 构: Application development center APR Shanghai Philips Automotive Lighting Shanghai, China
• 出 处: The 2nd International Forum on Automotive Lighting,2nd IFAL(
• 发表日期: 2014年期

　　Thanks to unique styling opportunities, high energy efficiency, long lifetime and dynamic features, LED headlamps have gained a strong position in the market.Further development is ongoing at fast pace.Recent developments in thermal design of LEDs and LED systems enable new, compact, cost-saving LED headlamps with increased performance.Especially LED light sources with improved thermal performance and optimized hot-cold factor allow for a significant reduction of heatsink size.LED plug&play light sources for headlighting as well as signaling applications reduce the engineering effort in lamp design.LED modules and systems based on low Rth PCB allow for the design of high performance LED headlamps with simplified thermal management, enabling various applications like DRL, front fog, distributed low beam and matrix beam.These functions require good thermal contact between LED package and PCB board.In this contribution we will outline the thermal challenges of LED frontlighting systems at both LED source and module levels, discuss the most relevant developments and provide an outlook on future developments.