Preparation of a new type of polyamidoamine and its application for soy flour-based adhesives

• 作 者: ChengshengGui;XiaoqingLiu;DiWu;TuoZhou;GuyueWang;JinZhu;
• 机 构: Ningbo Key Laboratory of Polymer Materials, Ningbo Institute of Material Technology and Engineering,
• 出 处: 2014年全国博士后新材料技术与应用学术论坛
• 发表日期: 2014年期

　　The most commonly used curing agents for soy-based adhesives are polyamines, which have the problem of low solid content and/or high viscosity.To overcome this problem, a new type of polyamidoamine (PADA) resin was synthesized and applied to soy flour-based adhesives to improve their water resistance.The obtained PADA solution had high solid content of 50wt% and low viscosity of 270cP.The optimum weight ratio of soy flour/PADA/maleic anhydride to prepare adhesive was40/7/1.68.The wet strength of plywood prepared at the optimum weight ratio was0.82MPa, which meant the plywood could be used as type II plywood according to the Chinese National Standard GB/T 9846.7-2004.The results of water-insoluble solid content measurement and SEM observation demonstrated that cured soy flour-PADA-Maleic anhydride adhesive had 16% greater water-insoluble solid content than soy flour-NaOH adhesive.The cross-linking network formed by the reactions of PADA and MA would increase water-insoluble solid contents and improve water resistance of cured soy flour-based adhesives.