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To date, the most frequently used top-down fabrication methods for nanodevices are electron-beam lithography (EBL) and focused ion beam (FIB) techniques.EBL is capable of defining diverse patterns down to nanoscale dimensions in polymer resists.It is normally combined with stripping (lift-off) or etching (dry etching and wet etching) to transfer patterns.For the lift-off method, it is cumbersome to make the fabrication process effective when the features go down to tens of nanometers,especially for dense arrays, because resists are difficult to strip away.