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Micro-particles and nano-wires,small outgrowths were found to appear on upper flm surface when metal thin flm is confned between two Si3N4 layers deposited by magnetron sputtering and is annealed at an appropriate temperature.The stress evolution during this process is monitored by multi-beam optic stress sensor,and is qualitatively interpreted in terms of elastic and plastic deformation,as well as bulk diffusion.Additionally,the interface constraint effect among different layers is explored.Stress relaxation of nano-sandwiched thin flms behaves in different stress modes.As a comparative study,Si3N4/Zn/Si3N4 sandwiches were prepared and studied by the same method.Experimental results show that the pertinent geometry is strongly dependent on material types and stress states of the substrates.Finally,an appropriate mode was suggested to interpret this phenomenon.