Microstructure and properties of Cu-containing a-C thin films by a hybrid process

• 作 者: 孙德恩;
• 机 构: 重庆大学
• 出 处: 第六届海内外中华青年材料科学技术研讨会暨第十五届全国青年材料科学技术研讨会
• 发表日期: 2015年期

　　In present study,Cu-containing amorphous carbon(a-C:Cu)thin films were prepared on(100)Si substrate by a hybrid process where co-operating of a filter cathodic vacuum arc and a magnetron sputtering.Cu content in the a-C:Cu was changed by changing the Cu magnetrons puttering power density from 0 to 4.93 W/cm2.The composition of as-deposited thin films was characterized using energy dispersive X-ray spectroscopy,the surface chemical state using X-ray photoelectron spectroscopy,wettability of the a-C:Cu top surface was examined through water contact angle measurements using the VCA optima XE,and the microstructure using Raman spectroscopy.The results showed that increasing Cu content resulted in an increase of water contact angle,better bonding strength and better plasticity,but the fiction coefficient and wear rate are increased.