WAFER相关论文
A kind of 2 GHz to 8GHz MMIC variable gain low noise amplifier chip,WFD0 0 2 0 ,was designed,and fabricated successfully......
Two-dimensional(2D)slab photonic crystal waveguides(PCWGs)on silicon-on-insulator(SOI)wafer were designed and fabricated......
A two-step process of Ni silicide formed on bulk silicon,and the effects of different process conditions,including two-s......
Currently,200 mm wafer foundry companies are beginning to explore production feasibility under ground rules smaller than......
Pit formation and surface morphological evolution in Si(001) homoepitaxy are investigated by using scanning tunneling mi......
Some wafer fabrication processes performed by cluster tools require revisiting. With wafer revisiting, a cluster tool is......
A ball grid array (BGA) package based on Si interposer with through silicon via (TSV) was designed. Thermal behaviors of......
Using Technology Computer-Aided Design(TCAD) 3-D simulation,the single event effect(SEE) of 25 nm raised source-drain Fi......
The planarization mechanism of alkaline copper slurry is studied in the chemical mechanical polishing (CMP) process from......
Firstly, this paper presents an orthogonal test of six factors and five levels, called the chemical mechanical polishing......
We demonstrate and introduce here a pyramidally patterned metal reflector into wafer-bonding AlGaInP light emitting diod......
Electrostatic chucks are one of the core components of semiconductor devices. As a key index of electrostatic chucks, th......
The dream of epitaxially integrating III-nitride semiconductors on large diameter silicon is being fulfilled through the......
We propose a novel silicon optical phase shifter structure based on heterogeneous strip-loaded waveguides on a photonic ......
Thermal characteristics are numerically investigated for the hybrid AlGaInAs/InP on silicon microring lasers with differ......
The gate leakage current and reliability concern become more serious due to the aggressive scaling-down of the gate oxid......
本轮课程改革强调的三维目标中，情感目标成为一个令人瞩目的内容，但纵观课程至今对情感因素的研究，可以发现绝大多数的理解与实践都集......
We present a micro-Pirani vacuum gauge using the low-resistivity monocrystal silicon as the heaters and heat sinks fabri......
A high etch rate GaAs via-hole process was studied in an inductively coupled plasma system using Cl2/BCl3 gas system. Th......
This paper proposes a novel miniature dual-functional sensor integrating both pressure and temperature sensitive units o......
Scalable synthesis of transfer-free graphene over insulators offers exciting opportunity for next-generation electronics......
Yankee Doodle went to town riding on a pony. He stuck a feather in his hat and called it macaroni. ......
Image boundary extraction based on island model genetic algorithms for integrated circuit defect det
该文从挂篮荷载计算、施工流程、支座及临时固结施工、挂篮安装及试验、合拢段施工、模板制作安装、钢筋安装、混凝土的浇筑及养生......
This article aims to develop an effective method to extract manufacturing inteligence for evaluating manufacturing tool ......
Image boundary extraction based on island model genetic algorithms for integrated circuit defect det
The integrated circuit chip with high performance has a high sensitivity to the defects in manufacturing environments. W......
Wafer pre-aligning system is an important component in IC manufacturing industry. A wafer prealigning platform with a CC......
化学机械抛光CMP工艺是集成电路制造的核心技术,90%以上的高端CMP机台设备和抛光液、抛光垫等关键耗材均被国外供应商垄断。阐述CM......
集成电路芯片不断向高密度、高性能和轻薄短小方向发展,为满足IC封装要求,图形硅片的背面减薄成为半导体后半制程中的重要工序.随......
讨论圆片剪冲下料方案的设计问题。下料方案由一组排样方式组成。首先构造一种生成圆片条带最优四块排样方式的背包算法,然后采用......
在集成电路（IC）行业中,化学机械抛光（CMP）是获得全局平坦化的技术.随着晶圆直径的增加,在CMP加工过程中,晶圆边缘容易出现“过磨（over-g......
封装是微制造工艺中，非常重要的一个环节.本文将圆片键合的各种工艺分为3类:场助直接键合、表面活性键合、借助中介层键合.并对其适......
阈值电压是半导体晶圆测试的一个重要指标,它和半导器件参数等许多方面有紧密的联系,magic number（N）是一个基于线度计算阈值电压经......
摘要：硅材料产业是信息技术产生与发展的一项基础性产业。硅材料本身并不神奇，源于沙子，但它是通过一定的高精尖技术手段加工成的芯片......
讨论多板材单一圆片剪冲下料问题,即使用剪冲工艺将若干种不同尺寸的板材剪冲出一定数量的单一尺寸圆片,优化目标是使得材料利用率......
翘曲度是鉴别晶片几何参数好坏的重要指标之一。采用逐点扫描法对多线切割制备的晶片翘曲度分布进行了测量。通过对切割线张力、砂......
对半导体工艺中晶片的边缘磨削技术进行了论述，分析了晶片边缘磨削技术的特点，在此基础上，提出了一种高效、可靠的晶片边缘磨削方法。......
在高端光刻机中,为提高预对准的精度,需要对预对准过程中硅片的边缘位置进行稳定.文中对-种硅片边缘位置稳定装置的设计原理、结构......
随着数字化技术在诸多领域的迅猛发展,使得控制技术的发展更趋于数字化,对复杂设备的控制便显得尤为明显,针对DJ-801硅片倒角机控......
探讨了硅片自动定位方法及软件控制原理,并提出了一种硅片自动定位技术的实现方法及软件控制方法,实现对硅片平边和V型槽及硅片中......
设计了正交实验,探究了腐蚀温度、辊筒转速、鼓泡时间、提臂摇动速率与腐蚀速率和TTV变化的影响;发现酸腐蚀过程中,宜设置适中的温......
晶圆目标提取是晶粒计数系统的重要处理环节,是确保晶粒计数准确度的前提条件。目前主要应用阈值化方法将晶圆目标从背景中提取出......
概述了DB-6120全自动芯片键合机图像处理系统的组成及工作原理,重点介绍了软件结构及设计方法,并对晶片及芯片对准、芯片识别技术......
OLYMPUS自1919年生产日本第一台光学显微镜至今,一直作为先进精密光学仪器的生产制造企业服务全球.在当代,OLYMPUS更是融合光学,精......
从IC生产线晶圆片旋转冲洗甩干工艺出发,介绍了半导体晶圆片清洗后的旋转冲洗甩干方法,以及新近开发研制的CXS系列旋转冲洗甩干机......
随着微电子机械系统制造工艺和先进的封装技术的不断发展,迫切需要厚抗蚀剂工艺技术.其在微电子机械系统的应用领域包括体硅微机械......
回顾当前IC制造中使用的清洗技术是如何减少、消除或避免晶圆片表面沾污的发展历史.同时探讨优化晶圆片表面状态的重要性和寻求一......
分析了硅片预对准设备的工作原理、流程及计算方法,并在实验数据的基础上详细讨论了各种方法的优缺点。......
介绍了晶粒扫描技术和广度优先搜索算法,研究了使用广度优先搜索算法进行晶粒扫描的应用条件和编程实现方法。该方法需要CCD系统一......
介绍了全自动晶圆划片机设备软件系统的设计与实现。根据设备自动化程度高，功能模块多、复用性强、耦合性强且复杂的特点，将软件系统......
