为进一步提高红光微型发光二极管(LED)阵列器件的能量利用效率,对倒装AlGaInP LED阵列器件的光电性能进行研究。首先,测试对比了垂......

随着微电子技术的需求和发展,倒装芯片技术在高密度微型化封装领域得到了快速发展和广泛应用,而现有的一些倒装芯片检测方法存在一......

A new device has been realized using flip-chip joining two printed circuit boards(PCBs) on which zinc oxide(ZnO) nanowir......

A reliability of flip-chip bonded die as a function of anisotropic conductive paste (ACP) hybrid materials, bonding cond......