采用雾化施液化学机械抛光(CMP)的方法, 以材料去除速率和表面粗糙度为评价指标, 选取最适合硒化锌抛光的磨料, 通过单因素实验对......

To improve polishing quality and cope with the shortage of skilled workers for aluminum wheel-hub surface polishing, an ......

针对泵送结构件用的高强钢板,选择0.6 mm钢丝切丸、0.6 mm高碳铸钢丸、0.6 mm铸钢丸、0.8 mm铸钢丸4种磨料,通过欧文试验比较了这4......

ving efficiency and developing the nozzle....

The nanotopography of the surface of silicon wafers has become an important issue in ULSI device manufacturing since it ......

CdZnTe wafers were machined by lapping and mechanical polishing processes, and their surface and subsurface damages were......