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采用凝胶注模法制备SiC预制件用于无压熔渗液态铝合金实现60～67 vol%SiCp/Al复合材料的近净成形制备,研究了碳化硅颗粒级配及热处理对复合材料力学和热学性能的影响。结果表明:不同粒度的SiC粉体在铝基体中分布均匀,无明显偏聚现象;采用较细的SiC颗粒级配和退火处理都能有效提高复合材料强度;粗颗粒级配能增大SiC在复合材料中的体积分数,有利于导热性能的提高和热膨胀系数的降低;SiCp/Al复合材料抗弯强度介于240～365 MPa,室温时热导率介于122～175 W.m-1.℃-1之间,室温至250℃的平均线热膨胀系数小于7.5×10-6℃-1,满足电子封装的性能要求。
The preparation of SiC preform by gel injection molding is used to prepare near-net shape of 60 ~ 67 vol% SiCp / Al composites without pressure infiltrating into liquid aluminum alloy. The effect of SiC particle size distribution and heat treatment on the mechanical properties of composites Effect of thermal properties. The results show that SiC powders with different grain sizes distribute evenly in the aluminum matrix without obvious segregation phenomenon. The fine SiC particles gradation and annealing treatment can effectively improve the strength of the composites. The volume fraction of the composites increases the thermal conductivity and decreases the thermal expansion coefficient. The flexural strength of SiCp / Al composites ranges from 240 to 365 MPa and the thermal conductivities at room temperature range from 122 to 175 Wm-1. 1, the average linear thermal expansion coefficient from room temperature to 250 ℃ is less than 7.5 × 10-6 ℃ -1, to meet the performance requirements of electronic packaging.