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由IPC SMEMA委员会组织的,主要面向电子组装业工程师和经理人,为电子组装工艺的所有领域提供全面解决方案的电子组装工艺展示会(Electronics Assembly Process Exhibition and Conference;APEX),于2002年1月19-24日在圣地牙哥展会中心举行。 与会者来自世界各地,包括亚洲的电子工程师和经理人,他们集中讨论了采用新兴技术的电子组装工艺及设备,如面阵列(球栅阵列、芯片级封装及倒装
The Electronics Assembly Process Exhibition and Conference (APEX), organized by the IPC SMEMA Committee for engineers and managers in the electronics assembly industry that provide complete solutions for all areas of the electronic assembly process, performed in January 2002 19-24 at the San Diego Convention Center. Participants from around the world, including electronic engineers and managers in Asia, focused on emerging technologies for electronic assembly processes and equipment such as area arrays (ball grid arrays, chip scale packages and flip-chip