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为了揭示SiCp/Al复合材料的切削机理,提高其切削加工性,建立了一种SiCp颗粒和Al基体分离的有限元仿真模型,使用有限元软件ABAQUS从微观角度研究切屑的形成过程、基体和颗粒的内部应力分布,分析了不同切深和切削速度条件下切削力的变化规律,为了验证有限元仿真模型的有效性,进行了车削实验。仿真和实验结果表明:由于Si C颗粒的存在产生大量的微裂纹以及孔洞,形成表面缺陷,且剪切区域微裂纹的扩展是产生切屑的重要因素;而实验获得的切削力变化及其波动与仿真结果一致,进一步验证了仿真模型的有效性,为实际加工的切削参数优化提供参考。
In order to reveal the cutting mechanism and improve the machinability of SiCp / Al composites, a finite element simulation model was established to separate SiCp particles and Al matrix. The formation process of chip, matrix and particles were studied by using finite element software ABAQUS. The internal stress distribution was analyzed. The variation of cutting force under different cutting depth and cutting speed was analyzed. In order to verify the validity of the finite element simulation model, a turning experiment was carried out. Simulation and experimental results show that due to the presence of Si C particles, a large number of micro-cracks and cavities are formed, surface defects are formed, and the propagation of micro-cracks in the shear zone is an important factor for chip generation. However, the change of cutting force and its fluctuation The simulation results are consistent, which further validates the validity of the simulation model and provides a reference for the optimization of cutting parameters in the actual machining.