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Recently, a governing parameter for electromigration damage in passivated polycrystalline lines, AFD*gen, was formulated considering the effect of the atomic density gradient. In this study, a prediction method for electromigration failure in a passivated polycrystalline line was proposed using AFD*gen. The characteristics of film used for prediction is established in advance using a method based on AFD*gen. The film characteristics of metal lines with different lengths were determined experimentally by AFD*gen_based method. From the film characteristics obtained, both lifetime and location of failure in the passivated polycrystalline lines were predicted through numerical simulation of failure process. Good agreement has been shown between the predicted and the experimental results concerning both lifetime and location of failure.
Recently, a governing parameter for electromigration damage in passivated polycrystalline lines, AFD * gen, was formulated considering the effect of the atomic density gradient. In this study, a prediction method for electromigration failure in a passivated polycrystalline line was proposed using The characteristics of film used for prediction is established in advance using a method based on AFD * gen. The film characteristics of metal lines with different lengths were determined experimentally by AFD * gen _based method. From the film characteristics obtained, both from lifetime and location of failure in the passivated polycrystalline lines were predicted through numerical simulation of failure process. Good agreement has been shown both in predicted and the pilot results concerning both lifetime and location of failure .