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为了提高大直径硅片表面质量,利用超声浮动抛光加工宏观磨削力、磨削应力、磨削热小,对加工材料表面损伤低的特点,再结合相关磨料对超高精度大直径硅片表面进行超声浮动抛光加工。在工作机理研究的基础上,对大直径硅片超声浮动抛光加工进行了实验研究,优化了其工作参数,获得了满意的效果,为该技术的实际应用奠定了理论与实验基础。
In order to improve the surface quality of large-diameter silicon wafer, using ultrasonic floating polishing macroscopic grinding force, grinding stress, small grinding heat, low damage to the surface of the material processed, combined with the relevant abrasive on the ultra-high precision large diameter silicon surface Ultrasonic floating polishing. Based on the research of working mechanism, the ultrasonic floating polishing of large diameter silicon wafers was experimentally studied, the working parameters were optimized and the satisfactory results were obtained, which laid the theoretical and experimental foundation for the practical application of the technology.