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高速半导体激光器组件的综合优化设计需要全面考虑激光器组件封装过程中的各种因素.在研究高速光电子器件的频响测试、建模分析和寄生补偿等技术的基础上,提出了一种高速半导体激光器组件的综合优化设计方法,并进行了半导体激光器的TO封装和优化实验,封装后组件的带宽达到10GHz,并且改善了带内平坦度和相频线性度等特性,验证了该方法的可行性.
The comprehensive optimization design of high-speed semiconductor laser components needs to fully consider the various factors in the process of laser component packaging.On the basis of researching the technology of frequency response test, modeling analysis and parasitic compensation in high-speed optoelectronic devices, a high-speed semiconductor laser Component optimization design method, and the semiconductor laser TO encapsulation and optimization experiments, the package components bandwidth of 10GHz, and to improve the in-band flatness and phase frequency linearity and other characteristics of the feasibility of the method verified.