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T-Lam体系是一种高导热性印制电路板或基材。该板或基材是由层压金属和介质层构成的。该T-Lam体系从T-Preg介质层派生,它的唯一性能是被层压在金属层之间。 该T-Lam体系能良好的适用于高温、高电压和高电流多层印制电路板。该T-Preg与
T-Lam system is a high thermal conductivity printed circuit board or substrate. The plate or substrate is composed of a laminated metal and a dielectric layer. The T-Lam system derived from the T-Preg dielectric layer, its only property is laminated between the metal layer. The T-Lam system is well suited for high temperature, high voltage and high current multilayer printed circuit boards. The T-Preg and