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我厂是电子工业部“七五”期间重点协作厂,主要生产半导体分立器件、塑封引线及IC框架,电镀工艺有镀金、银、镍、锡及局部镀金、脉冲镀金和局部镀银。我单位在黄金节约和回收方面主要作了以下几点工作。 1.从废液及清洗水中提取黄金; 2.将镀金废件金层剥离提取黄金; 3.利用脉冲技术电镀,节约黄金; 4.局部镀金节约黄金。
Our factory is the key cooperation factory during the “Seventh Five-Year Plan” period of the Ministry of Electronics Industry. It mainly produces semiconductor discrete devices, plastic lead wires and IC frames. The electroplating process includes gold plating, silver, nickel, tin and local gold plating, pulse gold plating and local silver plating. My unit in the gold saving and recycling mainly made the following work. 1. Extraction of gold from the waste and cleaning water; 2. Peel off the gold plating scrap gold extraction; 3. The use of pulse plating technology, saving gold; 4. Local gold-plated gold.