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本文简要介绍了厚膜混合集成电路的基本制造工艺,论述了厚膜混合集成电路的特点及其在微波频段(UHF及更高)上应用的可行性和优越性,列举了一些典型应用实例,说明了厚膜混合技术在微电子领域中占有重要地位。一、引言 50年代中期以来,在电子系统中利用印刷电路板将分立元件组装成组件的工艺得到了广泛的应用。到了60年代,随着小型化和可靠性要求的进一步提高,集成电路迅速发展,并在许多领域中取代了分立组件,使电子设备的结构和性能发生了根本的变革。但是,在现代的电子设备中,光有单片式
This article briefly introduces the basic manufacturing process of thick-film hybrid integrated circuits, discusses the characteristics of thick-film hybrid integrated circuits and their feasibility and superiority in microwave frequency band (UHF and higher), and gives some typical application examples. It shows that the thick film hybrid technology occupies an important position in the field of microelectronics. I. INTRODUCTION Since the mid-1950s, the process of assembling discrete components into printed circuit boards in electronic systems has been widely used. By the 1960s, with the further miniaturization and reliability requirements, the rapid development of integrated circuits and the replacement of discrete components in many fields led to fundamental changes in the structure and performance of electronic devices. However, in modern electronic devices, the light is monolithic