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现在,在半导体器件和集成电路中,其电极(布线)材料一般都用蒸发铝膜。特别是在集成电路中,为了高密度化和提高成品率,其电极(布线)的形成更是如此。本文概述用电解腐蚀形成铝电极的方法。图形形成技术——铝电极形成技术铝电极的形成方法,已知有光刻腐蚀法,选择阳极氧化法等等,可分类如下:1.把不要部分去除法(1)光刻腐蚀法——化学腐蚀法,电解腐蚀法。(2)剥离法——在片子上预先把光刻抗蚀剂膜涂复在电极以外的不要部分上进行铝蒸发。其后,用剥离剂将抗蚀剂膜去除,抗蚀剂上的蒸发铝膜也被剥离而形成铝电极。
Now, in semiconductor devices and integrated circuits, the electrode (wiring) materials are generally evaporated aluminum film. Particularly in integrated circuits, the formation of electrodes (wiring) is particularly so in order to increase the density and improve the yield. This article outlines a method of forming an aluminum electrode by electrolytic etching. Graphic Forming Technology - Aluminum Electrode Forming Technology The forming of aluminum electrodes is known as photolithography, selective anodization and the like and can be classified as follows: 1. Removal of unwanted portions (1) Photolithography - Chemical etching method, electrolytic etching method. (2) Peeling method - A film of resist is pre-coated on an unnecessary part of the film except for the electrode to evaporate aluminum. Thereafter, the resist film is removed with a release agent, and the evaporated aluminum film on the resist is also peeled off to form an aluminum electrode.