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中国电子学会生产技术学会焊接学组首次“微电子焊接技术讨论会”于1982年10月8日至12日在石家庄市召开。参加讨论会的有来自全国各地37个单位的54名代表,电子工业部河北半导体研究所副总工程师常振华同志主持了这次讨论会。会议共收到论文41篇,其中大会发言88篇。代表们分芯片焊接,引线焊接和封装焊接三个专题组进行了充分的学术讨论。并对今后的发展提出了一些建设性的意见。
China Institute of Electronics Society of production welding group for the first time “Microelectronics Welding Technology Symposium” in October 1982 8-12 in Shijiazhuang City. There were 54 representatives from 37 units across the country attending the symposium. Comrade Chang Zhenhua, the deputy chief engineer of Hebei Institute of Semiconductors, Ministry of Electronics Industry, presided over the symposium. A total of 41 papers were received during the conference, including 88 speeches by the General Assembly. Delegates were divided into chip welding, lead welding and packaging welding of the three special groups conducted a full academic discussion. And put forward some constructive suggestions on the future development.