论文部分内容阅读
得克萨斯仪器公司的微电子制造科学技术(MMST)计划,正在为九十年代中期发展一种通用的半导体器件制造技术。原位真空处理、组件式群集加工设备、基于传感器的实时过程控制以及计算机集成制造,是这项活动的基本组成部分。虽然这项计划的目标是发展和论证低容积、快循环时间和成本合理的硅微电子制造技术,但是这种技术也同样适用于HgCdTe、GaAs以及其它材料。本文讨论了MMST原理与技术在得克萨斯仪器公司HgCdTe焦平面列阵生产中的推广使用和发展。概略地介绍了通用加工组件、传感器以及能源的使用,并将它们在硅集成电路和HgCdTe焦平面列阵应用中的使用情况进行了比较。讨论了通用组件和为满足HgCdTe特定的加工要求而定制的组件。
Texas Instruments’ Microelectronics Manufacturing Science and Technology (MMST) program is developing a common semiconductor device manufacturing technology for the mid-nineties. In-situ vacuum processing, component-based cluster processing equipment, sensor-based real-time process control, and computer integrated manufacturing are an essential part of this activity. Although the goal of this program is to develop and demonstrate low-volume, fast cycle time and cost-effective silicon microelectronics manufacturing technology, this technology is equally applicable to HgCdTe, GaAs, and other materials. This article discusses the use and development of MMST principles and techniques in the Texas Instruments HgCdTe focal plane array manufacturing. The use of general process components, sensors, and energy is outlined and their use in silicon integrated circuits and HgCdTe FPA applications is compared. Discussed common components and components tailored to meet HgCdTe specific processing requirements.