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将CuCr0.9合金进行一定的变形和时效处理,分析其硬度和导电率变化,并通过显微组织分析,探讨时效温度对CuCr0.9合金组织与性能的影响。结果表明,CuCr0.9合金在40%变形后,400℃及以下时效时难以充分再结晶,基体残留变形组织,而500℃以上时效时,晶粒会出现长大现象,450～500℃为理想时效区间,其硬度和导电率也达到较好的配合。透射电镜分析结果表明,此时晶内存在较高密度位错,提高了材料的硬度,而Cr相以共格形式析出,对材料的硬度和导电率均有较大的贡献。40%变形,475℃下时效2 h,硬度可达到137 HV0.1,导电率达到87%IACS。
The CuCr0.9 alloy was subjected to some deformation and aging treatment. The hardness and electrical conductivity of the CuCr0.9 alloy were analyzed. The effect of aging temperature on the microstructure and properties of CuCr0.9 alloy was also investigated by microstructure analysis. The results show that the CuCr0.9 alloy is difficult to recrystallize after 40% deformation at 400 ℃ and below, and the matrix will remain deformed. When the temperature is above 500 ℃, the grains will grow, and 450 ~ 500 ℃ is the ideal Aging range, its hardness and conductivity also achieve better cooperation. Transmission electron microscopy analysis showed that there was a higher density of dislocations in the crystal at this time, which increased the hardness of the material, while the Cr phase precipitated in a coherent manner, which contributed greatly to the hardness and electrical conductivity of the material. 40% deformation, aging at 475 ℃ 2 h, the hardness can reach 137 HV0.1, the conductivity of 87% IACS.