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CⅡ(陶瓷互连计划)成员单位和陶瓷互连技术领域的专家在第32届国际微电子研讨会(即IMAPS’99)会议上交流陶瓷互连技术方面解决方案的论文。此次会议于99年10月26～28日举行,由IMAPS主办。陶瓷互连技术使产品设计人员能够开发高频、高密度互连、小尺寸封装和恶劣环境下性能好的封装和互连产品。陶瓷解决方案包括能够内埋无源元件,适合于很多正在开拓的应用领域,如移动通信、无线电基站、卫星通信和汽车电
CII (Ceramic Interconnection Program) member units and experts in ceramic interconnect technology to exchange solutions for ceramic interconnect technology at the 32nd International Microelectronics Symposium (IMAPS’99). The conference was held on October 26-28, 1999 and hosted by IMAPS. Ceramic interconnect technology enables product designers to develop high-frequency, high-density interconnects, small form-factor packages and high performance packages and interconnects in harsh environments. Ceramic solutions include the ability to embed passive components for many of the growing applications such as mobile communications, radio base stations, satellite communications and automotive power