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基于互连网络的RLCπ型等效模型,考虑电感的屏蔽作用和非理想的阶跃激励,提出了互连线网络在斜阶跃激励下的焦耳热功耗计算方法,极大地简化了互连网络中电流和功耗的表达式.基于90nm金属氧化物半导体(CMOS)工艺的互连参数对所提出的计算方法进行了计算和仿真验证,对于上升信号小于1ns的情况,计算结果与Hspice仿真结果的误差小于3%,具有很高的精度,适合应用于大规模互连网络中的功耗估算和热分析.
Based on the RLCπ equivalent model of interconnected networks and considering the shielding effect of inductors and the non-ideal step excitation, a method for calculating Joule heating power consumption of an interconnection network under oblique step excitation is proposed, which greatly simplifies the interconnection Current and power consumption in the network.According to the interconnection parameters of the 90nm CMOS process, the proposed calculation method is calculated and verified by simulation. For the case that the rising signal is less than 1ns, the calculation result is in good agreement with the Hspice simulation The result is less than 3% error, with high accuracy, suitable for power estimation and thermal analysis in large scale interconnected networks.