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The technology of cold pressure welding was adopted to achieve the bonding of Al/Cu(limited soluble and forming compounds), Ag/Ni (hardly mutual soluble), and the relative state of interface was tested by HREM. The results indicate that stable interface is always corresponding to the low interfacial energy value; the stable interface is not coherent but partly-coherent because of the twisting of grain boundary caused by pressure, meanwhile existing dislocation. Namely, the interfacial match and other states under the condition of cold pressure welding are different from the situation that under the condition of thermal action. Moreover, theoretical analyses and calculation on the base of thermodynamics, crystallogeny, solid physics etc, were discussed.
The technology of cold pressure welding was adopted to achieve the bonding of Al / Cu (limited soluble and forming compounds), Ag / Ni (hardly mutual soluble), and the relative state of interface was tested by HREM. The results indicating that stable interface is always corresponding to the low interfacial energy value; the stable interface is not coherent but partly-coherent because of the twisting of grain boundary caused by pressure, meanwhile existing dislocation. Namely, the interfacial match and other states under the condition of cold pressure welding are different from the situation that under the condition of thermal action. Moreover, theoretical analyzes and calculation on the base of thermodynamics, crystallogeny, solid physics etc, were discussed.