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设计了Au—Al键合点的温度冲击试验,分析了键合点的力学特性、结构形貌及电学性能。结果表明Au—Al键合界面无裂纹产生,且机械性能良好,键合拉力在3.0~12.0g之间;高温导致Au—Al间形成了电阻率较高的化合物Au5Al2;最终引起键合电失效。对目前工艺水平下的Au—Al键合可靠性进行了评价,发现其寿命分布服从威布尔分布规律。用图估法估算取置信度为95%时,特征寿命η为547h,形状参数m为3.83。基于器件可靠性评价规律预测出了该工艺条件下制备的Au—Al键合寿命,取可靠度为90%时,试验样品在常温25℃时的寿命为1.8×105h,约20年。
The temperature impact test of Au-Al bonding point was designed and the mechanical properties, structural morphology and electrical properties of bonding point were analyzed. The results show that the Au-Al bonding interface is free of cracks and the mechanical properties are good. The bonding tension is between 3.0 and 12.0g. Au5Al2 with high resistivity is formed at high temperature. . The reliability of the Au-Al bonding at the current process level was evaluated and it was found that the life distribution obeys Weibull distribution. When estimating the confidence level by 95%, the characteristic lifetime η is 547h, and the shape parameter m is 3.83. The lifetime of the Au-Al bond prepared under this process condition was predicted based on the device reliability evaluation rule. The test sample had a life of 1.8 × 10 5 h at about 25 ℃ with a reliability of 90% for about 20 years.