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意法半导体率先将硅通孔技术(TSV)引入MEMS芯片量产。在意法半导体的多片MEMS产品(如智能传感器、多轴惯性模块)内,硅通孔技术以垂直短线方式取代传统的芯片互连线方法,在尺寸更小的产品内实现更高的集成度和性能。硅通孔技术利用短垂直结构连接同一个封装内堆叠放置的多颗芯片,相较于传统的打线绑定或倒装芯片堆叠技术,硅通孔技术具有更高的空间使用效率和互连线密度。意法半导体已取得硅通孔技术专利权,并将其用于大规模量产制造产品,此项技术有助于缩减MEMS芯片尺寸,同时可提高产品的稳定性和性能。
STMicroelectronics is the first to introduce TSV technology into MEMS chip production. Within STMicroelectronics’ multi-chip MEMS products, such as smart sensors and multi-axis inertial modules, TSV technology replaces the traditional chip interconnect approach with vertical stub lines to achieve higher levels of integration in smaller form factors And performance. Through-silicon via technology uses short vertical structures to connect multiple chips stacked in the same package, resulting in higher space efficiency and interconnectivity compared to traditional wire bonding or flip chip stacking Linear density. STMicroelectronics has acquired TSV technology patents and used them for mass production of products that will help reduce MEMS chip size while improving product stability and performance.