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薄膜的热导率是薄膜热学性能的最重要参数之一,相对于多数文献的二维或三维测试结构,本文采用一维双端支撑悬臂梁结构研究了薄膜热导率的测试方法.悬臂梁包含上层的兼做加热电阻及测温电阻的金属条和下层的待测试薄膜.利用一维热传导方程推导并获得了在直流电流加热条件下,悬臂梁的温升分布(△T)及加热电阻两端电压增量(△U)表达式与薄膜热导率之间的关系.采用ANSYS有限元软件仿真了不同仿真参数时的△T及△U,仿真结果与温升表达式计算结果符合得很好.与常用的3倍频率法(3w)薄膜热学性能测试方法相比,一维悬臂梁直流法测试结构及手段较为简单且可以获得更为精确的结果.
The thermal conductivity of the film is one of the most important parameters of the thermal properties of the film. Compared with the two-dimensional or three-dimensional test structure of most literatures, this paper adopts a one-dimensional double-end support cantilever structure to study the method of testing the thermal conductivity of the film. Which comprises the upper metal strip which is also used as the heating resistor and the temperature measuring resistor and the film to be tested in the lower layer.The temperature distribution of the cantilever beam (ΔT) and the heating resistance The relationship between the voltage increment (△ U) and the thermal conductivity of the film was obtained by using ANSYS finite element software. The simulation results of △ T and △ U with different simulation parameters were in good agreement with the results of temperature rise calculation Very good.Compared with the commonly used 3 times frequency method (3w) thin film thermal performance test method, the one-dimensional cantilever DC test method is simple and can obtain more accurate results.