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使用表面安装元器件的设计（续一）丹东半导体器件总厂王英强，张美娜（１１８００２）２热设计２．１概述ＳＭＴ开发了一系列ＩＣ以解决很小空间里有更多的元器件。元器件集成密度的增加同时增加了单位面积上的热耗散。过去ＩＣ常用双列直插外形包封（ＤＩＬ），而现在Ｓ...
Design of Surface Mount Components (Continued) Dandong Semiconductor Devices General Factory Wang Yingqiang, Zhang Meina (118002) 2 Thermal Design 2.1 Overview SMT has developed a series of ICs to solve the problem of having more components in a small space. Increased component integration density also increases heat dissipation per unit area. In the past, ICs used double in-line outline encapsulation (DIL), and now S ...