Optoelectronic Smart Pixels Comprising Flip-Chip-Bonded GaAs/AlGaAs MQW Detectors and Modulators on

• 作 者: 陈弘达 梁琨 曾庆明 李献杰 陈志标 杜云 吴荣汉
• 出 处: 半导体学报
• 发表日期: 2000年08期
• 关键词: AlGaAs bonding exciton receiver reflectivity switching modulator removed complet

Optoelectronic smart pixels with hybrid integration of GaAs/AlGaAs multiple quantum well (MQW) detectors and modulators arrays have beed made,which are flip|chip bonded directly on the top of 1μm silicon CMOS circuits,as enables an achievement of Optoelectronic Integrated Circuits (OEIC) as well as does the design and optimization of CMOS circuits and GaAs/AlGaAs MQW devices to proceed independently.

Optoelectronic smart pixels with hybrid integration of GaAs / AlGaAs multiple quantum well (MQW) detectors and modulators arrays have beed made, which are flip | chip bonded directly on the top of 1 μm silicon CMOS circuits, as enables an achievement of Optoelectronic Integrated Circuits (OEIC) as well as does the design and optimization of CMOS circuits and GaAs / AlGaAs MQW devices to proceed independently.